Machine de l'électronique X Ray
Équipement d'inspection par rayons X avec conception de tube scellé
X-Ray Inspection Equipment Product Description: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Features: Large Size Inspection Table. Laser ...
Haute résolution pour Test de qualité de soudure PCBA BGA, équipement à rayons X, système d'inspection UNICOMP AX9100MAX SMT IC
UNICOMP AX9100MAX X-Ray Inspection System High-resolution X-ray equipment for PCBA BGA solder quality testing and SMT IC inspection with advanced non-destructive testing capabilities. System Overview This advanced X-ray inspection system is designed for high-precision non-destructive testing of ...
UNICOMP AX9100MAX, reconstruction à super résolution AI, détecteur de défauts de soudure SMT certifié CE FDA
AI Super-Resolution Reconstruction UNICOMP AX9100MAX CE FDA Certified SMT Solder Void Defect Detector Advanced X-ray inspection system for electronics IC components and bonding wire analysis with high precision non-destructive testing capabilities. This system is widely deployed for high-precision ...
la carte PCB PTH minimum de 5μm a plaqué l'équipement de QC de défaut de mur intérieur du trou AX8300MAX Unicomp
AX8300MAX X-ray Inspection System Advanced 5μm minimum PCB PTH plated through hole inspection equipment with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Features 110kV sealed tube technology with maximum 47.7X geometric magnification for PCBA inspection. ...
Détecteur d'inclinaison maximale de 60 °, Inspection automatique CNC AX8300MAX Unicomp PTH, testeur d'inspection de défauts
Detector Max 60° Tilt CNC Automatic Inspection AX8300MAX Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Features 110kV sealed tube technology with maximum 47.7X geometric magnification for PCBA inspection. Applications This ...
Détecteur d'inclinaison maximale de 60°, platine rotative à 360° BGA AX8300MAX Unicomp HIP, inspecteur de tête dans l'oreiller
AX8300MAX X-ray Inspection System Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Features 60° tilt and 360° rotary stage for BGA and HIP (Head-In-Pillow) inspection. Applications This system is widely applicable to semiconduc...
Détecteur à panneau plat, table de travail, assemblage de PCB BGA AX8300MAX Unicomp, Scanner de joints de soudure à froid
AX8300MAX X-ray Inspection System Advanced industrial X-ray inspection system specifically designed for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection system is extensively deployed for ...
5μm résolution minimale CNC électronique BGA paquet AX8300MAX Unicomp manquant boule de soudure QC détecteur
AX8300MAX Unicomp Missing Solder Ball QC Detector This advanced industrial X-ray inspection system delivers 5μm minimum resolution for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection ...
Fonction de numérisation automatique CNC, résolution minimale de 5μm, contrôle d'accès par empreinte digitale, composant SMT BGA AX8300MAX Unicomp
AX8300MAX X-ray Inspection System Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Features CNC auto scanning function with 5μm minimum resolution for fingerprint access control, SMT, and BGA component inspection. Applications ...
