Machine de l'électronique X Ray
Machine industrielle d'inspection à rayons X 110KV, pour l'analyse des vides de soudure IGBT, UNICOMP AX8300MAX
110KV Industrial X-ray Inspection Machine for IGBT Solder Voiding Analysis UNICOMP AX8300MAX This advanced industrial X-ray inspection system is specifically designed for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial ...
Machine d'inspection à rayons X Microfocus 160KV pour la liaison de fils de semi-conducteurs NDT AX9600 Unicomp
160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT AX9600 Unicomp The UNICOMP AX9600 160KV microfocus X-ray inspection system is equipped with a proprietary 160kV high-power open-type microfocus X-ray tube, achieving an ultra-fine focal spot of merely 0.8 μm. Supporting a ...
Machine de semi-test UNICOMP, balayage multi-angle, inclinaison à 60 °, détection des défauts de soudure cachés PCBA BGA X-ray AX9100
60° Tilt Multi-angle Scan Hidden Solder Defect Detection PCBA BGA X-ray AX9100 UNICOMP Semi Testing Machine Advanced X-ray inspection system designed for comprehensive defect detection in electronic components and industrial applications. Key Features 130KV 7μm X-Ray tube for precise imaging High ...
Testeur de rayons X de fil de liaison à résolution de 90 kV 5 μm pour semi-conducteurs CX3000 Équipement d'inspection des liens aurifères Unicomp
CX300 Unicomp Gold Bond Inspection Equipment 90kV 5μm Resolution Bonding Wire Semiconductor X-ray Tester for precise inspection and quality control. Applications BGA, CSP, LED, Flip Chip, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Aerospace Components, ...
Équipement d'inspection d'assemblage SMT, imagerie haute définition 2,5D, chevauchement du vide BGA X-ray AX9100 UNICOMP SMT
High Definition 2.5D Imaging Overlapped Void BGA X-ray AX9100 UNICOMP SMT Assembly Inspection Equipment Product Overview The Unicomp AX9100 represents advanced X-ray inspection technology for comprehensive SMT assembly quality control, featuring high-definition 2.5D imaging and specialized void ...
Système d'inspection des joints de soudure vides BGA UNICOMP AX8300, système à rayons X pour l'assurance qualité de la fabrication PCBA
SMT electronics x ray machine sealed type X-ray Tube x-ray 110kv AX8300 X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. (Offline X - Ray series) widely used in offline detection, defect analysis, used for PCBA, packaging, ...
Système d'inspection à rayons X CNC, Rotation à 360 °, assemblage automatique de PCB MOSFET, performances stables Unicomp AX8300MAX
Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis Application This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ...
Machine d'inspection à rayons X électronique commune de soudure d'inclinaison BGA AX8300MAX Unicomp, analyse automatique des vides
Tilt BGA Solder Joint Electronics X-ray Inspection Machine AX8300MAX Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Applications This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), ...
Imagerie de pénétration profonde Vérification des défauts de porosité interne Moulage sous pression Rayons X AX9600 Unicomp
Deep Penetration Imaging Internal Porosity Defect Checking Die Casting X-ray AX9600 Unicomp The UNICOMP AX9600 high-power micro-focus X-ray inspection system delivers ultra-precision non-destructive testing for advanced semiconductor and electronic components, featuring deep penetration imaging for ...
