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High Resolution For PCBA BGA Solder Quality Test X‑ray Equipment UNICOMP AX9100MAX SMT IC Inspection System

Propriétés de base
Lieu d'origine: Chine
Nom de la marque: UNICOMP
Attestation: CE, FDA
Numéro de modèle: AX9100 max
Propriétés commerciales
Quantité minimum de commande: 1 ensemble
Prix: can negotiate
Conditions de paiement: LC, T/T
Capacité d'approvisionnement: 30 ensembles par mois
Résumé du produit
UNICOMP AX9100MAX X-Ray Inspection System High-resolution X-ray equipment for PCBA BGA solder quality testing and SMT IC inspection with advanced non-destructive testing capabilities. System Overview This advanced X-ray inspection system is designed for high-precision non-destructive testing of ...

Détails du produit

Mettre en évidence:

PCBA BGA solder test X-ray equipment

,

SMT IC inspection X-ray machine

,

high resolution X-ray equipment for PCBA

Machine Type: Système d'inspection électronique à rayons X des semi-conducteurs
Model: AX9100 max
X-Ray Tube Type: Type scellé
Pixel Size: 84 μm
Pixel: 1536*1536
Footprint: 1450(L)×1765(P)×1835(H)mm
Description du produit
UNICOMP AX9100MAX X-Ray Inspection System High-resolution X-ray equipment for PCBA BGA solder quality testing and SMT IC inspection with advanced non-destructive testing capabilities. System Overview This advanced X-ray inspection system is designed for high-precision non-destructive testing of electronics IC components and bonding wire analysis. It is widely deployed across industrial and semiconductor applications for quality control and R&D verification. Applications BGA,
Notation globale
5.0
★★★★★
★★★★★
Basé sur 50 critiques récemment
cinq étoiles
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  • J
    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE
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