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Systèmes d'inspection automatiques de X Ray de sécurité de fruit de nourriture 40-120kV pour la détection d'aiguille
Food Safety Automatic X-ray Inspection Systems for Unpackaged Products Model UNF6040 Max Voltage 40-120kV Max Current 0.2-7.5mA Inspection Speed (m/min) 10-50 Inspection Accuracy(mm) Stainless steel ball ø0.5,Stainless steel wire 0.2x1.5, Glass2.0,Plastic 1.5 Image system Linear detector array Belt Food grade belt, length can be customized Tunnel Size(mm) 600x400 Max.Loading Weight 10kg Monitor 19' Dimension(WxDxH,mm) 1600x790x1800 Weight 500kg Safety
Caméra Unicomp X Ray 130kV de HD pour inspecter des conseils de PCBA
Application SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Aluminium Die-casting, Moulding Plastic. Electronic components, Automotive parts, Photo-voltaic, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions
soudure de l'électronique X Ray Machine For SMT BGA de 0.8kW 5um FDA
X-Ray Inspection Machine Electronics BGA Standard Multifunction Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Applications:BGA , CSP , LED , Flip Chip , Semiconductor,Battery Industry , Small Metal Casting,Electronic Connector Module,Aerospace Components , Photovoltaic Industry,Other Special Industries. System
NDT moulant le design compact de machine de NDT X Ray, résolution de détecteur de 2.8LP/Mm
NDT Industrial X Ray Inspection Systems Compact Design Manufacturer Unicomp UNC320 is a compact industrial X-ray inspection system designed for broad aerospace and foundry (automotive) applications. Flexible 2D inspection of casting defects and production flaws provide the confidence of a safe and reliable analysis. Features: Reliable inspection decisions based on outstanding image quality High-speed wheel inspection of the heaviest wheels with our new gripper manipulator
Unicomp vêtx/vêtement nourriture et systèmes d'inspection de la boisson X Ray 40-120kV
Unicomp clothes garments X-ray Inspection Systems in Food Processing Plants detecting foreign matter Unicomp Efficient X-ray inspection systems are available for systematic detection and elimination of foreign material. They help food makers safeguard consumer health, mitigate the risk for extensive recall campaigns, and make sure that the reputation of their brands and compliance with applicable regulations remain intact. X-ray inspection systems are used wherever defects
Contrôle de défauts interne de foyer de l'électronique X Ray de l'électronique micro de système SMT
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending, with
Système élevé de l'électronique X Ray de rapport optique pour l'inspection de vide de BGA CSP/QFN/PoP
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing
Inspection intérieure programmable de qualité de boule de golf de machine de l'électronique X Ray de détection de commande numérique par ordinateur
Application Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution FPD Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and
Temps réel à grande vitesse de machine multifonctionnelle de l'électronique X Ray pour la boule d'or
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Ceramics, other special industries. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Multi-function DXI image processing
