x ray detector
"
Système d'insepction de rayon X d'Unicomp pour le contrôle de contamincation de corps étrangers de nourriture de boîte en vrac de paquet
Unicomp X-ray insepction system for pack bulk can food foreign matter contamincation check APPLICATION UNX4015-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Features Provide High precision automatic foreign detection, It can effectively identify metal, ceramic, glass, bone,
Machine à rayons X Unicomp AX9100max 130kV 65W pour l'inspection des IGBT
Unicomp AX9100max X-ray Machine For IGBT The Unicomp AX9100max X-ray Machine is designed for IGBT inspection and widely applied in various industries including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Functions and Features Inspection Image Technical Parameters and Specifications Dimensions and Appearance
Unicomp AX9100max X-ray Machine 130kV For IGBT Testing
Unicomp AX9100max X-ray Machine 130kV For IGBT Testing The Unicomp AX9100max X-ray Machine is designed for IGBT inspection and widely applied in various industries including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Functions and Features Inspection Image Technical Parameters and Specifications Dimensions and Appearance
Inspection aux rayons X Unicomp AX8300MAX 110KV pour les fissures internes dans les composants en céramique
Unicomp AX8300MAX 110KV X-ray Inspection for Internal Cracks in Ceramic Components Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 5 µm 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual screen design, multi-task
Inspection aux rayons X Unicomp 110KV pour la détection des vides MOSFET et l'analyse de fiabilité AX8300MAX
Unicomp AX8300MAX 110KV X-ray Inspection for Internal Cracks in Ceramic Components Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 5 µm 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual screen design, multi-task
Détecteur d'antenne réseaux rectilignes d'inspection d'Unicomp X Ray Machine PCBA BGA de détection de SMT SME
High Resolution Digital SMT EMS Detection X Ray Machine PCBA / BGA Inspection Linear Array Detector Specifications Operation System Windows Operation System 22" LCD Monitor Keyboard and Mouse X-Ray Machine Dimensions:1080(W)X1180(D)X1730(H) Packing Size:1420*1420*2000mm Weight: 1150KG Magnification:600X Power Requirements:220VAC 50Hz Temperature/Humidity:0℃～ 40℃ / 30 ～ 70RH Power Consuption(Max):0.5KW X-Ray Tube Voltage : 100KV Max Current: 200 μA Focal Spot Size: 5 micron
Équipement de test de montage à haute résolution de PCBA BGA Unicomp AX7900
Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of X-Ray machine AX7900: Adopts high-performance 90kV micro-focus X-ray tube with 5μm focal spot and high-sensitivity FPD flat panel detector. Built with precision multi-axis XY motion platform, optional ±60° oblique viewing angle is available. Independent Z-axis adjustment for X-ray source and detector freely optimizes imaging magnification and detection field range.Precise optical point
Machine d'essai de semi-conducteur du rayon X AX7900 Unicomp de l'imagerie PCBA BGA de sensibilité élevée
The Most Economic X-Ray inspection machine AX7900 with high performance Description of IC X Ray machine AX7900: This machine integrates a 90kV micro-focus X-ray tube with 5μm focal spot and high-quality FPD digital flat detector. Standard precise XY multi-axis motion is configured, along with optional ±60° angular tilting detection. The synchronized Z-axis adjustment of X-ray source and detector smoothly regulates imaging magnification and field of view. Featuring quick
En aluminium la détection programmable de commande numérique par ordinateur de machine de SMT de moulage mécanique sous pression/SME X Ray pour des vides de BGA
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. SMT, BGA, CSP, Flip Chip, LED Detection Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing system, CNC programmable detection 130kV (Option 110KV) 3µm closed X-ray tube, high speed &
