Machine de l'électronique X Ray
Machine d'inspection à rayons X plaquée PCBA, point de mise au point de 5μm, trou traversant, détecteur de défauts vides AX8300 Unicomp PTH
5μm Focus Spot PCBA Plated Through Hole X-ray Inspection Machine AX8300 The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray ...
Machine industrielle d'inspection à rayons X 90KV AX7900, pour lampe LED, vide de soudure et rupture de fil, UNICOMP
90KV Industrial X-ray Inspection Machine AX7900 for LED Lamp Bead Solder Void and Wire Breakage UNICOMP Product Overview The AX7900 industrial X-ray inspection system features a high-performance 90kV X-ray tube with 5μm ultra-high resolution and a high-sensitivity FPD flat-panel detector. Built with ...
Machine industrielle d'inspection à rayons X 110KV, pour l'analyse des vides de soudure IGBT, UNICOMP AX8300MAX
110KV Industrial X-ray Inspection Machine for IGBT Solder Voiding Analysis UNICOMP AX8300MAX This advanced industrial X-ray inspection system is specifically designed for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial ...
Machine d'inspection à rayons X Microfocus 160KV pour la liaison de fils de semi-conducteurs NDT AX9600 Unicomp
160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT AX9600 Unicomp The UNICOMP AX9600 160KV microfocus X-ray inspection system is equipped with a proprietary 160kV high-power open-type microfocus X-ray tube, achieving an ultra-fine focal spot of merely 0.8 μm. Supporting a ...
Machine de semi-test UNICOMP, balayage multi-angle, inclinaison à 60 °, détection des défauts de soudure cachés PCBA BGA X-ray AX9100
60° Tilt Multi-angle Scan Hidden Solder Defect Detection PCBA BGA X-ray AX9100 UNICOMP Semi Testing Machine Advanced X-ray inspection system designed for comprehensive defect detection in electronic components and industrial applications. Key Features 130KV 7μm X-Ray tube for precise imaging High ...
Testeur de rayons X de fil de liaison à résolution de 90 kV 5 μm pour semi-conducteurs CX3000 Équipement d'inspection des liens aurifères Unicomp
CX300 Unicomp Gold Bond Inspection Equipment 90kV 5μm Resolution Bonding Wire Semiconductor X-ray Tester for precise inspection and quality control. Applications BGA, CSP, LED, Flip Chip, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Aerospace Components, ...
Équipement d'inspection d'assemblage SMT, imagerie haute définition 2,5D, chevauchement du vide BGA X-ray AX9100 UNICOMP SMT
High Definition 2.5D Imaging Overlapped Void BGA X-ray AX9100 UNICOMP SMT Assembly Inspection Equipment Product Overview The Unicomp AX9100 represents advanced X-ray inspection technology for comprehensive SMT assembly quality control, featuring high-definition 2.5D imaging and specialized void ...
Système d'inspection des joints de soudure vides BGA UNICOMP AX8300, système à rayons X pour l'assurance qualité de la fabrication PCBA
SMT electronics x ray machine sealed type X-ray Tube x-ray 110kv AX8300 X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. (Offline X - Ray series) widely used in offline detection, defect analysis, used for PCBA, packaging, ...
Système d'inspection à rayons X CNC, Rotation à 360 °, assemblage automatique de PCB MOSFET, performances stables Unicomp AX8300MAX
Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis Application This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ...
