Machine de l'électronique X Ray
Imagerie microfocus 2D 2,5D pour la vérification des défauts PCBA QFP Semi-conducteur UNICOMP AX9100MAX
AX9100MAX Semiconductor X-Ray Inspection System Optimized for high-precision non-destructive testing of semiconductors and electronics, the AX9100MAX provides comprehensive inspection capabilities for IC curvature measurement and various electronic components with micro-focus 2D/2.5D imaging ...
Liaison 7 axes haute résolution pour qualité de soudure PCBA QFN, programmation hors ligne UNICOMP AX9100MAX
AX9100MAX High Resolution 7-Axis X-Ray Inspection System The UNICOMP AX9100MAX represents the pinnacle of precision non-destructive testing technology, featuring high-resolution 7-axis linkage for comprehensive PCBA QFN solder quality inspection with advanced off-line programming capabilities. ...
Amélioration de l'image AI, Rotation plein angle 360 °, pour dispositif de test électronique PCBA QFP UNICOMP AX9100MAX SMT
AX9100MAX X-Ray Inspection System Full-angle 360° Rotation AI Image Enhancement for PCBA QFP SMT Electronic Testing Device Optimized for high-precision non-destructive testing of semiconductors and electronics, the AX9100MAX provides comprehensive inspection capabilities for IC curvature measurement ...
Reconstruction AI super résolution, inspection d'inclinaison maximale de 60 ° pour PCBA QFN UNICOMP AX9100MAX SMT
AI Super-Resolution Reconstruction X-Ray Inspection System AX9100MAX SMT with Maximum 60° Tilt Inspection for PCBA, QFN, and UNICOMP Applications Optimized for high-precision non-destructive testing of semiconductors and electronics, the AX9100MAX provides comprehensive inspection capabilities for ...
Haute résolution pour le système d'inspection IC SMT de programmation hors ligne PCBA QFP UNICOMP AX9100MAX
AX9100MAX Off-line Programming SMT IC Inspection System High-resolution X-ray inspection system optimized for precision non-destructive testing of semiconductors and electronics, providing comprehensive capabilities for IC curvature measurement and electronic component analysis. Applications BGA, ...
Équipement d'inspection à rayons X pour rasoir électrique avec une taille de pixel de 84 μm
X-Ray Inspection Equipment for Electric Razor Description of IC X Ray machine AX7900: It is broadly utilized in various sectors such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small-scale Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, ...
équipement d'inspection de rayon X de taille de tache de foyer de 5μm pour la capacité de PCBA 1240kg
X-Ray Inspection Equipment for PCBA Description of IC X Ray machine AX7900: It is widely employed across multiple industries, including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, ...
Mise à niveau vers le détecteur à panneau plat équipement d'inspection par rayons X FPD pour IC avec matrice de pixels 1536 * 1536 mm
X-Ray Inspection Equipment for IC Description of IC X Ray machine AX7900: It has extensive applications in diverse fields such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Production, Miniature Metal Casting, Electronic Connector Assemblies, Wiring, Aerospace Parts, and ...
Système de rayon X de microfocus de 90KV 5um avec FPD de haute résolution pour la vérification de soudure de vide de PCBA BGA
90KV 5um microfocus X-ray system with high resolution FPD for PCBA BGA soldering void checking Specifications of SMT Xray machine: System Summary Footprint 1215(W)×1325(D)×1700(H)mm Machine Weight 1240 kg Power Supply AC 220V, 50/60Hz Plywood Packing Size 1680(W)×1680(D)×2200(H)mm Packing Weight ...
