x ray imaging system
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Machine industrielle de CT d'Unicomp UNCT2000 pour l'inspection de fissures de logement de cellule de batterie de véhicules électriques
High resolution industrial CT machine Unicomp UNCT2000 for electric vehicles battery cell housing cracks inspection Function Application: Equipment Features: Powerful Function: DR and CT dual system, Tomography, 3D rebulid and analysing. High Safety: Multiple safety protection measurements, meets all the international safety standards. User Friendly: User friendly system, easy operation. High Precision Inspection: High-precision mechanical transmission system, advanced image
Système d'inspection à rayons X de composants MOSFET de haute précision, inspection d'inclinaison améliorée, performances stables AX8300 Unicomp
Enhanced Tilt Inspection High Precision MOSFET Component Xray Inspection System AX8300 Unicomp Stable Performance The AX8300 X-ray inspection system is extensively deployed for circuit board and semiconductor inspection. As an offline X-ray solution, it is widely adopted in offline testing and defect analysis, ideal for PCBA, semiconductor packaging, ceramics, plastics, LED components and other precision electronic parts. System Summary Dimension 1215(W)∗1325(D)∗1700(H)mm
la machine du rayon X NDT de la radiographie DR du Multi-manipulateur 160KV pour les pièces de moulage de petit alumimum fendent la vérification de porosité
Multi-manipulator 160KV Radiography DR X-ray NDT Machine for small alumimum Casting Parts crack porosity checking Technical Data of UNC160s Attribute Respective Value Sample Dimensions Outer width: 250 [mm] max. Outer diameter: 550 [mm] max. Maximum Sample Weight 15 [kg] System Dimension 1480mm*1106mm*2038mm(L*W*H) X-ray Tube 160 [kV] Detector Active Area 250*550mm Pixel Pitch 139 [m] Maximum penetration(AL) 100mm/20mm Detector Resolution 3.1LP/mm Our goal is to solve
Équipement d'inspection par rayons X à microfocus à semi-conducteurs Unicomp AX8300 Plus
Unicomp X-ray AX8300 Plus Semiconductor Microfocus X-ray Inspection Equipment Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 2 µm 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual screen design, multi-task parellel
Machine d'inspection par rayons X des aliments pour vérifier les matières étrangères dans les aliments en conserve sèche
X-Ray detection equipment for dry pack food inspection with auto rejector Applications of Food Xray UNX4015-N UNX4015-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Features of Food Xray Easy to Operate: one button start & stop, optional default product Provide High precision
Système à rayons X Unicomp AX7900 90KV 2D pour une détection précise des vides BGA
Unicomp AX7900 90KV 2D X-ray System for Accurate BGA Void Detection Description of BGA X-Ray machine AX7900: Equipped with 90kV / 5μm micro-focus X-ray tube and high-performance FPD detector, AX7900 adopts a multifunctional workstation design. It features standard XY multi-axis motion with optional ±60° tilt. Independent Z-axis movement of X-ray tube and FPD allows flexible adjustment of magnification and FOV. Integrated with target positioning system and professional DXI
Assemblage de circuits imprimés à travers trou de haute précision PTH rayons X AX7900 Unicomp Haute stabilité
X-Ray Inspection Equipment AX7900 UNICOMP AX7900 is a professional high-resolution micro-focus X-ray NDT testing machine for SMT production, semiconductor packaging and new energy battery quality inspection. Built with proprietary self-developed X-ray source and high-sensitivity digital imaging detector, it clearly visualizes invisible internal defects of electronic devices. It precisely detects BGA solder voids, interlayer separation of PCB boards, chip bonding defects,
Système d'inspection d'assemblage de PCB à rayons X AX9600 Unicomp SMT, détection de vide BGA PCBA BGA à imagerie claire
Clear Imaging BGA Void Detection PCBA BGA X-ray AX9600 Unicomp SMT PCB Assembly Inspection System UNICOMP AX9600 adopts an in-house developed 160kV high-power open micro-focus X-ray tube with an ultra-fine 0.8μm focal spot. It supports magnification up to 2000× and offers superior X-ray penetration, enabling precise void content measurement for TVS diodes. Optimized for high-end semiconductor inspection, it caters to high-precision quality control of advanced IC packaging,
Produit électrique avec appareil à rayons X Unicomp UNC160
Electricity product with Unicomp UNC160 X-Ray device Product Description: It is mainly applied for non-destructive examination of a wide range of products, including metal castings, hardware components, plastic items, refractory substances, composite materials, ceramic structures, and welded metal sections. Features: Widespread Applications: Large inspection size and loading weight capacity Safety Standard: High level protection with international standard, multiple safety
