x ray imaging system
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5 inspection automatique de tuyau de radiographie de la commande numérique par ordinateur 2D X Ray Machine Unicomp UNC225 d'axe
5 Axis automatic CNC 2D X-Ray machine Unicomp UNC225 Radiography system for pipes welded seams quality testing Technical Dat Attribute Respective Value Maximum penetration(FE) 150mm/25mm Equipment weight 5T System Dimension 2230mm*1582mm*2478mm(L*W*H) X-ray Tube 225KV Power 640W/1600W Pixel Pitch 139μm Focal size 1.0mm/3.0mm Image Area 250mm x 300mm Non Destructive Testing (NDT) is an important part of industrial quality management. Much Digital Radiography (DR) standards
Équipement à haute densité Unicomp 225KV général de détecteur de la faille X Ray en métal
General 225KV High Density Metal Flaw X Ray Detector Equipment Unicomp Non Destructive Testing (NDT) is an important part of industrial quality management. Many Digital Radiography (DR) standards like the EN-17636 or NADCAP demand a high accuracy and reliable archiving of test-results. Unicomp has years long experience with many different applications and industries. As requirements vary between industries and even companies all systems can be easily customized and adapted.
Inspection aux rayons X Unicomp AX8300MAX 110KV pour les fissures internes dans les composants en céramique
Unicomp AX8300MAX 110KV X-ray Inspection for Internal Cracks in Ceramic Components Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 5 µm 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual screen design, multi-task
Inspection aux rayons X Unicomp 110KV pour la détection des vides MOSFET et l'analyse de fiabilité AX8300MAX
Unicomp AX8300MAX 110KV X-ray Inspection for Internal Cracks in Ceramic Components Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 5 µm 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual screen design, multi-task
Nourriture et machines d'inspection des industries pharmaceutiques X Ray 1600x790x1800mm
Food X-Ray Detection and Inspection Systems for Foreign Matters Specification : Model UNF6040 Max Voltage 40-120kV Max Current 0.2-7.5mA Inspection Speed (m/min) 10-50 Inspection Accuracy(mm) Stainless steel ball ø0.5,Stainless steel wire 0.2x1.5, Glass2.0,Plastic 1.5 Image system Linear detector array Belt Food grade belt, length can be customized Tunnel Size(mm) 600x400 Max.Loading Weight 10kg Monitor 19' Dimension(WxDxH,mm) 1600x790x1800 Weight 500kg Safety
Temps réel efficace non destructif de systèmes d'inspection de l'essai X Ray de culture intégrée pour des matières étrangères
Inline Crop NDT X Ray System , Effective Foreign Materials Real-time Detector Product Feature Flexibility Tooling and Fixture Easy to Operate, User-friendly Software Design Customized to Provide Solutions After-sales Service of Entire Network Low Cost of Testing Service Inspection Image:
Compteur durable de puce de X Ray, composant de machine de l'électronique X Ray comptant l'industrie 4,0 d'inventaire de SME
SMD Chip Electronic Component Unicomp X ray Counter Inspection System This equipment is mainly used for the rapid counting of the production of reel materials, the material type includes all the resistance-type materials and IC materials; through the use of X-RAY imaging of the production materials and access to image information, R & D of the image algorithm calculation, access to the actual number of materials, while the number of materials in accordance with the classifica
Contre- BGA X Ray machine d'inspection de la puce BGA micro sur l'analyse de côtelette
Chip Counter BGA X Ray Inspection Machine Micro BGA on chop analysis X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. OUR SERVICE 1.Your inquiry will be replied in 12 hours. 2.Original Manufacture to
Le rayon X électronique de l'équipement AX8200 d'inspection de résistance de jeu de puces de SMT a clôturé 5g
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
