x ray detection systems
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Chaîne de production en ligne de temps réel de X Ray de biologie fiable élevée bleue d'équipement
Biology Online Production Line Real Time X Ray Inspection Equipment System Unicomp Unicomp RY-80 is a high-resolution turnkey x-ray inspection system that is designed to be fully integrated into a production line. Typically the RY-80 is robot loaded and controlled using the same automation control as the manufacturing processes. 1. RY-80 is a cabinet based system built largely from stainless steel to withstand corrosive environments 2. Typically used for products up to 300mm
Fruit végétal industriel de systèmes d'inspection de X Ray d'agriculture installé
Agriculture Industrial X Ray Inspection Systems Vegetable Fruit Installed in China Whether in the automotive, electronics or aircraft industry or for ship and vessel construction, Unicomp Technology is offering industrial X-ray inspection systems for nondestructive material testing which can fit in any manufacturing process and guarantee highest quality and safety standards for industrial products. Full cycle support from products design to testing procedures and high-quality
Tests non destructifs industriels multifonctions DR CT à double imagerie CT UNCT3500 Unicomp
Multi-function DR CT Dual Imaging Industrial X-ray CT UNCT3500 Unicomp Non-Destructive Testing Detection purpose: Adaptable to a wide range of sizes and materials, this system meets the diverse industrial CT application requirements of various sectors. It is primarily utilized for the precision inspection of medium-to-large-scale products, including metal castings and non-ferrous metals, lithium-ion new energy battery modules, non-metallic workpieces, and composite materials.
Rayon X composant intégré de compteur de puce de rayon de SMT SMD X pour l'inventaire d'entrepôt
Inline SMT SMD X ray Component Chip counter X-ray for warehouse inventory This equipment is mainly used for the rapid counting of the production of reel materials, the material type includes all the resistance-type materials and IC materials; through the use of X-RAY imaging of the production materials and access to image information, R & D of the image algorithm calculation, access to the actual number of materials, while the number of materials in accordance with the
Plein système d'imagerie numérique d'inspection de canalisation de fonction d'équipement multi de l'axe NDT X Ray
Multi-Axis Full Function Pipeline inspection Digital Imaging System X-ray flaw detection is the difference in the degree of X-ray absorption by using different thicknesses of materials. By using X-ray fluoroscopy and industrial television real-time imaging, the internal defects of materials, parts and welds are revealed from the film and the image. Such as cracks, shrinkage cavities, pores, slag inclusions, unmelted, incomplete penetration, etc., determine the location and
Contrôle de défauts interne de foyer de l'électronique X Ray de l'électronique micro de système SMT
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending, with
Système élevé de l'électronique X Ray de rapport optique pour l'inspection de vide de BGA CSP/QFN/PoP
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing
Temps réel à grande vitesse de machine multifonctionnelle de l'électronique X Ray pour la boule d'or
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Ceramics, other special industries. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Multi-function DXI image processing
Boule de golf de machine de l'électronique X Ray d'inspection de la carte PCB BGA à l'intérieur de la vérification de qualité
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement Multi-function DXI image processing system, CNC programmable
