electronics x ray system
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2.5D intitulant la rotation 360° de la machine 40W de l'électronique X Ray avec le mouvement de 6 axes
Application SMT, BGA, CSP, Flip Chip, LED Detection, Ceramics, other special industries. Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Features Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending, with convenient target point positioning system 130kV (Option 110KV) 7µm closed X-ray tube,
Contrôle de défauts interne de foyer de l'électronique X Ray de l'électronique micro de système SMT
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending, with
L'électronique X Ray Machine 1.0kW de l'algorithme FPD pour la soudure de ré-écoulement de LED
Unicomp newly released AX8200max X-ray machine with cutting-edge software algorithm for SMT BGA CSP QFN LED reflow solde Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3
Système élevé de l'électronique X Ray de rapport optique pour l'inspection de vide de BGA CSP/QFN/PoP
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing
Inspection intérieure programmable de qualité de boule de golf de machine de l'électronique X Ray de détection de commande numérique par ordinateur
Application Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution FPD Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and
Temps réel à grande vitesse de machine multifonctionnelle de l'électronique X Ray pour la boule d'or
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Ceramics, other special industries. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Multi-function DXI image processing
Boule de golf de machine de l'électronique X Ray d'inspection de la carte PCB BGA à l'intérieur de la vérification de qualité
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement Multi-function DXI image processing system, CNC programmable
Condensateur X électronique Ray Scanner Machine de moniteur d'affichage à cristaux liquides 24" haute précision
High Precision X Ray Machine 24" LCD Monitor Capacitor Inspection Application Function & Features Large Size Inspection Table Laser Locator for Precise Location 24’’ FHD Interactive Touch LCD Display Fingerprint Access Management System Real-time Monitoring of Radiation Accurate Control, CNC ProgrammingAutomatic Positioning FPD 60° Tilting Inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small
Inspection automatique programmable par CNC Machine électronique à rayons X AX9100MAX avec angle d'inclinaison de 60° pour la mesure de la courbure du CI
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
