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Qualité Unicomp AX9100max X-ray Machine 130kV For IGBT Testing Usine

Unicomp AX9100max X-ray Machine 130kV For IGBT Testing

Unicomp AX9100max X-ray Machine 130kV For IGBT Testing The Unicomp AX9100max X-ray Machine is designed for IGBT inspection and widely applied in various industries including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Functions and Features Inspection Image Technical Parameters and Specifications Dimensions and Appearance

Qualité Machine à rayons X Unicomp AX9100max pour cellules cylindriques Usine

Machine à rayons X Unicomp AX9100max pour cellules cylindriques

Unicomp AX9100max X-ray Machine For Cylindrical Cell Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Functions and Features Inspection Image Technical Parameters and Specifications Dimensions and Appearance

Qualité Machine à rayons X en temps réel avec tube à rayons X à focalisation de 5 microns pour vérifier les boules de soudure BGA Usine

Machine à rayons X en temps réel avec tube à rayons X à focalisation de 5 microns pour vérifier les boules de soudure BGA

X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to

Qualité Paquet programmable de bruit du kilowatt X Ray Machine For SMT BGA QFP de commande numérique par ordinateur 1,0 Usine

Paquet programmable de bruit du kilowatt X Ray Machine For SMT BGA QFP de commande numérique par ordinateur 1,0

X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to

Qualité soudure de l'électronique X Ray Machine For SMT BGA de 0.8kW 5um FDA Usine

soudure de l'électronique X Ray Machine For SMT BGA de 0.8kW 5um FDA

X-Ray Inspection Machine Electronics BGA Standard Multifunction Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Applications:BGA , CSP , LED , Flip Chip , Semiconductor,Battery Industry , Small Metal Casting,Electronic Connector Module,Aerospace Components , Photovoltaic Industry,Other Special Industries. System

Qualité 0.8kW BGA Void Measurement X Ray Machine For Mobile Phone PCBA Usine

0.8kW BGA Void Measurement X Ray Machine For Mobile Phone PCBA

X-Ray Inspection Machine Electronics BGA Standard Multifunction Technical Data System SummaryFootprint1080(W)×1180(D)×1730(H)mmMachine Weight1050 kgPower SupplyAC 110~220V, 50/60HzPlywood Packing Size146(W)×128(D)×196(H)cmPacking Weight1160 kgPower Consumption1.0 kWX-Ray TubeTube TypeSealedMax. Power8WVoltage0~90kV (Adjustable)Focus Spot Size5μmImaging SystemDetectorFlat Panel Detector (option 4’’ i.i. Detector)Pixel Size85μmEffective Detection Area130*130mmFrame Rates20fpsPi

Qualité La Chine Unicomp AX8200 BGA/IC/PCB a fermé la machine de rayon X avec le prix usine Usine

La Chine Unicomp AX8200 BGA/IC/PCB a fermé la machine de rayon X avec le prix usine

Smt X-ray Closed 5g Chipset Electronic Connector Module Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the

Qualité Machine multifonctionnelle de l'électronique X Ray, système d'inspection de BGA X Ray pour l'industrie de batterie Usine

Machine multifonctionnelle de l'électronique X Ray, système d'inspection de BGA X Ray pour l'industrie de batterie

X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to

Qualité FPD Unicomp AX8200B X en différé Ray Machine 100kv pour Li Ion Cell Usine

FPD Unicomp AX8200B X en différé Ray Machine 100kv pour Li Ion Cell

Smt X-ray Closed 5g Chipset Electronic Connector Module Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the