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bga x ray inspection system

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Qualité En mode de contrôle de mouvement du système d'inspection de bagages de Linex Ray commande numérique par ordinateur pour l'éclairage de LED Usine

En mode de contrôle de mouvement du système d'inspection de bagages de Linex Ray commande numérique par ordinateur pour l'éclairage de LED

In-line X-Ray Inspection Machine for LED Lighting Unicomp Technology upholds its Integrity, Deploitation and Excellence in the business, is committed to meeting the highest level of International Standards and promises to be a responsive partner with all of our customers. This philosophy has enabled Unicomp to generated a strong Global customer base of many International Renowned companies including Flextronics, Foxconn, Samsung, Philips, GM, Bosch, Emerson, Delphi,ABB, BYD,

Qualité Analyse de l'électronique intégrée X Ray Machine LX2000 FPC de SPC pour la soudure de BGA QFN Usine

Analyse de l'électronique intégrée X Ray Machine LX2000 FPC de SPC pour la soudure de BGA QFN

Fully automatic Inspection and Analysing Inline AXI LX2000 X-ray for BGA , QFN soldering void inspection one FPC Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor) Packing Weight 2000kg (X-Ray) / 800kg (Conveyor) Power Consumption 3.5 kW X-Ray Tube Tube Type Sealed Max.

Qualité Commande numérique par ordinateur de BGA QFN CSP X Ray Equipment LX2000 programmable pour la soudure de FPC SMT Usine

Commande numérique par ordinateur de BGA QFN CSP X Ray Equipment LX2000 programmable pour la soudure de FPC SMT

LX2000 inline x-ray equipment with CNC programmable inspection for FPC SMT soldering process of BGA , QFN, CSP parts Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor) Packing Weight 2000kg (X-Ray) / 800kg (Conveyor) Power Consumption 3.5 kW X-Ray Tube Tube Type Sealed

Qualité PCBA BGA LED QFN X Ray Scanning Machine Unicomp AX7900 pour le semi-conducteur Usine

PCBA BGA LED QFN X Ray Scanning Machine Unicomp AX7900 pour le semi-conducteur

High resolution micofocus X-Ray machine Unicomp AX7900 for SMT EMS PCBA BGA LED QFN soldering Void quality check Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max

Qualité Hautes résolutions d'inspection de la carte PCB PCBA BGA d'AX7900 Unicomp X Ray Machine SMT Usine

Hautes résolutions d'inspection de la carte PCB PCBA BGA d'AX7900 Unicomp X Ray Machine SMT

Unicomp AX7900 X-Ray machine with high resolutions FPD for SMT Printed circuit board PCBA BGA inspection Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max.

Qualité La haute résolution FPD de la machine AX7900 de PCBA Unicomp X Ray pour BGA meurent l'inspection de fil de liaison Usine

La haute résolution FPD de la machine AX7900 de PCBA Unicomp X Ray pour BGA meurent l'inspection de fil de liaison

PCBA X-Ray machine Unicomp AX7900 with high resolution FPD for BGA void IC die bond wire inspection Description of IC Xray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection

Qualité SME BGA 90kV 5um NDT X Ray Equipment FPD pour le cable connecteur de harnais Usine

SME BGA 90kV 5um NDT X Ray Equipment FPD pour le cable connecteur de harnais

Real Time close tube 90kV 5um X-ray Equipment with FPD for Wire Harness cable connector inner quality inspection Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max

Qualité Système de machine de l'électronique X Ray de semi-conducteur de SME pour l'inspection de BGA et de CSP Usine

Système de machine de l'électronique X Ray de semi-conducteur de SME pour l'inspection de BGA et de CSP

EMS Semiconductor Electronics X Ray Machine System for BGA and CSP inspection The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework

Qualité Compteur de puce de la haute performance X Ray, machine CX6000 de système d'inspection de X Ray Usine

Compteur de puce de la haute performance X Ray, machine CX6000 de système d'inspection de X Ray

Metal X Ray Component Counter Inspection System Machine CX6000 This equipment is mainly used for the rapid counting of the production of reel materials, the material type includes all the resistance-type materials and IC materials; through the use of X-RAY imaging of the production materials and access to image information, R & D of the image algorithm calculation, access to the actual number of materials, while the number of materials in accordance with the classification of