x ray inspection equipment
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Machine d'inspection de rayon d'Unicomp AX7900 90kV X pour l'inspection de soudure de qualité d'IC de vide de SMT BGA
Unicomp AX7900 90kV X ray inspection machine for SMT BGA soldering void IC quality inspection Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area
Radiateurs de 10 kilowatts NDT X Ray Equipment For Casting Defects/larmes chaudes/fluage à froid
Casting defects heat sinks, hot tears, cold-flow, drag-marks, missing material and cracks NDT X-Ray Inspection Application Fields of X Ray Machine UNZ-450 ● Engineering components ● Small aluminum castings, iron castings ● Auto parts, metal products Technical Parameters and Specifications of X Ray Machine UNZ-450 System Parameters Dimensions 2766mm*2813mm*2598mm(L*W*H) Equipment weight 17.5T Power 10 kW Maximum penetration (FE) 80 mm Detection range Φ550*200mm Load weight
Équipement de radiographie du Cabinet UNC160 NDT X Ray d'Unicomp pour des défauts de bâti de disque de frein
Unicomp Cabinet UNC160 NDT X Ray Radiography Equipment for Brake disc casting defects Technical Specifications of UNC160 System Parameters Dimensions 2100mm*1549mm*2468mm(L*W*H) Equipment weight 3.5T Power 6KW Maximum penetration(AL/FE) 100mm/20mm Detection range Φ500*800mm Load weight 50kg Work environment 5-40° ≤80%HR Install power Three-phase five-wire system AC380V X-ray leakage dose rate ≤1uSv/h X-ray Generator Tube voltage 160kV Power 480W Focal size 0.5mm Detector
Semi-conducteur de SMT BGA de l'électronique d'équipement de détection de rayon X de puissance élevée
High Power X-ray Detection Equipment Electronics SMT BGA Semiconductor Today, Unicomp Technology has three R&D /Manufacturing sites exceeding 25,000m2 respectively located at Wuxi/Jiangsu Province, Shenzhen/Guangdong Province, and Chongqing. Our sales and service centers are located all across China including Beijing, Shenyang, Tianjin, Xi'an, Qingdao, Wuhan, Chengdu, Ningbo , Xiamen and etc. The company has also penetrated into the international market with sales and service
Système d'inspection de SMT BGA X Ray
BGA X Ray Inspection Machine with integrated generator for SMT Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC/50Hz Power Consumption 0.8kW X-ray Tube Type Closed Max.Voltage 80kV/90kV Max.Power 12W/8W Spot Size 5μm/15μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 160 X/360X Detection Region Max.Loading Size 440mm x 400mm Max.Inspection Area 420mm x 380mm X-ray Leakage
Véhicule allumant le mouvement d'inclinaison de l'équipement 60° d'inspection de X Ray avec la fonction de commande numérique par ordinateur
EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
100KV système de détection intégré de X Ray ADR BGA SME pour l'inspection intérieure de qualité
Electronics SMT Cabinet Unicomp X-Ray Inspection System LX8500 Failure Analysis Features: ● Real-time image. ● 1000X system magnification. ● 100KV 5μm X-Ray tube. ● Modular design with In-line expansibility. ● Economical and Practical. ● FPD Detector. ● 6 axis linkage system. ● X-ray tube and FPD simultaneously tilt ±35°. Applications: ● LED,SMT,BGA,CSP,Flip Chip Inspection. ● Semiconductor,Packaging components,Battery Industry. ● Electronic components, Auto parts, Photovolta
3um a fermé le tube 1.6kW X Ray Machine For SMT BGA CSP
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor,
BGA QFN Unicomp X Ray Inspection System 130KV avec le mouvement de 6 axes
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage
