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Qualité SMT BGA soudant la machine de rayon X nulle de mesure Microfocus 130kV Usine

SMT BGA soudant la machine de rayon X nulle de mesure Microfocus 130kV

130kV 7 μm Microfovus X-Ray Machine For SMT BGA Soldering Void Measurement​ Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 1000X magnification, high-definition real-time image. ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● One

Qualité Tableau oblique de rotation de la vue 360 de l'électronique X Ray Machine With FPD d'AX9100 130kV Microfocus Usine

Tableau oblique de rotation de la vue 360 de l'électronique X Ray Machine With FPD d'AX9100 130kV Microfocus

AX9100 130kV microfocus X-ray with FPD oblique view and 360°rotation table for electronic components check Features of ​Unicomp AX9100: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications of ​Unicomp AX9100: ● SMT, BGA, CSP, Flip

Qualité vue oblique du tube AX9100 Unicomp X Ray Machine FPD de la fin 5um pour l'inspection d'IC Semicon Usine

vue oblique du tube AX9100 Unicomp X Ray Machine FPD de la fin 5um pour l'inspection d'IC Semicon

Unicomp 5μm close tube AX9100 X-ray machine with FPD oblique view for IC Semicon inspection Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage

Qualité Inspection de collage de champ de l'électronique X Ray Machine For Semiconductor Wire d'AX9100 130kV Usine

Inspection de collage de champ de l'électronique X Ray Machine For Semiconductor Wire d'AX9100 130kV

High Resolution of 130kV AX9100 X-ray for Semiconductor wire bonding sweep inspection Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage

Qualité Tube de fin d'AX9100 Unicomp X Ray Machine 130kV pour PCBA BGA QFN soudant le contrôle nul Usine

Tube de fin d'AX9100 Unicomp X Ray Machine 130kV pour PCBA BGA QFN soudant le contrôle nul

130kV maintenance free close tube X-ray machine Unicomp AX9100 For PCBA BGA QFN soldering Void check Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage

Qualité Unicomp AX9180 180kV Microfocus électronique machine à rayons X avec FPD oblique Usine

Unicomp AX9180 180kV Microfocus électronique machine à rayons X avec FPD oblique

Unicomp AX9180 : radiographie microfocus 180 kV avec taille de spot de 10 μm, inclinaison de 60° et liaison à 7 axes. Le FPD haute résolution offre un grossissement 1000X pour une inspection précise des PCB, BGA et semi-conducteurs. Comprend une garantie d'un an et une programmation hors ligne.

Qualité Machine à rayons X de PCB à grossissement élevé Unicomp AX9100MAX pour l'électronique Usine

Machine à rayons X de PCB à grossissement élevé Unicomp AX9100MAX pour l'électronique

High Magnifications PCB X-Ray Machine Unicomp AX9100MAX Advanced X-ray inspection system for electronics IC components and bonding wire analysis with high precision non-destructive testing capabilities. This system is widely deployed for high-precision non-destructive inspection across extensive industrial and semiconductor applications, covering BGA, CSP, flip chips, LED packaging components, fuses, power diodes, multi-layer PCBs, discrete semiconductors, and lithium battery

Qualité Basse inspection de la panne 225KV NDT X Ray Machine Automotive Aircraft Vessel Usine

Basse inspection de la panne 225KV NDT X Ray Machine Automotive Aircraft Vessel

Unicomp X ray NDT Machine Automotive Aircraft Vessel Inspection Systems UNC225π Features: ● High reliable and long life,low breakdown ● High definition and resolution FPD ● C-arm fixture design enabling five-axis motion detection(optional automatic lift and descend) ● Multi-functional workstation,360°rotation and shift ● User friendly software design for easy interfacing can facilitate,customized software ● High penetration,Voltage up to 225KV,Maximum penetration thickness up

Qualité Machine de haute résolution de la carte PCB X Ray Usine

Machine de haute résolution de la carte PCB X Ray

Electronics PCB parts X ray Machine with a high-resolution imaging chain X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight