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Qualité L'électronique X Ray Machine 110kV Unicomp AX8500 de CSP SMT pour SMT PCBA BGA QFN Usine

L'électronique X Ray Machine 110kV Unicomp AX8500 de CSP SMT pour SMT PCBA BGA QFN

Unicomp 2D AX8500 110kV Closed Tube X-ray for SMT PCBA BGA QFN soldering void measurement Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel

Qualité 1.6kW l'électronique X Ray Machine 130kV AX9100 pour le vide de soudure de SMT LED QFN Usine

1.6kW l'électronique X Ray Machine 130kV AX9100 pour le vide de soudure de SMT LED QFN

130kV Microfocus AX9100 X Ray For SMT LED QFN soldering void automatic mapping and measurement Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition

Qualité Unicomp AX9100 X Ray Machine SMT PCBA BGA LED QFN soudant la mesure nulle Usine

Unicomp AX9100 X Ray Machine SMT PCBA BGA LED QFN soudant la mesure nulle

SMT PCBA BGA LED QFN Soldering void measurement by Unicomp AX9100 X Ray Machine Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ●

Qualité 130kV Microfocus Unicomp X Ray AX9100 pour SMT LED BGA QFN vide la mesure Usine

130kV Microfocus Unicomp X Ray AX9100 pour SMT LED BGA QFN vide la mesure

130kV Microfocus X Ray Inspection Machine Unicomp AX9100 For SMT LED BGA QFN Voids measurement Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition

Qualité Puce AX8500 de CSP LED X Ray Machine Closed Tube Flip pour le semi-conducteur 100KV Usine

Puce AX8500 de CSP LED X Ray Machine Closed Tube Flip pour le semi-conducteur 100KV

Closed Tube Type AX8500 X Ray Machine for semiconductor Lead frame wiring bonding quality inspection Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector

Qualité Rapport optique Unicomp AX8500 de l'électronique X Ray Machine FPD 1000X de SMT BGA Usine

Rapport optique Unicomp AX8500 de l'électronique X Ray Machine FPD 1000X de SMT BGA

Unicomp AX8500 X Ray with FPD Detector and 1000X Magnification to check Semiconductor components quality issue Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel

Qualité Inspection de collage de champ de l'électronique X Ray Machine For Semiconductor Wire d'AX9100 130kV Usine

Inspection de collage de champ de l'électronique X Ray Machine For Semiconductor Wire d'AX9100 130kV

High Resolution of 130kV AX9100 X-ray for Semiconductor wire bonding sweep inspection Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage

Qualité Mode CNC automatique Les fissures des blocs du moteur Usine

Mode CNC automatique Les fissures des blocs du moteur

Dynamic Precise Casting Part Inspection Real Time X-ray Image System The UNC320 is the newest standard system. Whether you are inspecting small or large components, the UNC320 is the best option for customers needing a compact system with unique capabilities generally available on a larger X-ray or CT system. X-RAY SOURCE Micro-focus X-ray tube Voltage Range: 320 kV Minimum Focal Spot Size: ~5 microns MANIPULATOR Maximum Sample Weight: 150kg SYSTEM CAPABILITIES Advanced 2D X

Qualité Machine numérique à rayons X en temps réel AX7900 pour l'inspection des défauts internes du condensateur Usine

Machine numérique à rayons X en temps réel AX7900 pour l'inspection des défauts internes du condensateur

Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. APPLICATION of IC Xray machine AX7900: FEATURES of IC Xray machine AX7900: Technical Specifications of AX7900 Item Definition Specs System Summary Footprint 1200