industrial inspection systems
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L'électronique X Ray Chip Counter Unicomp CX7000L de haute précision avec l'imprimante de label
High Precision Electronics X-Ray Chip Counter Unicomp CX7000L High Efficiency Main Configuration 1. Bar-code Scanner 2. X-ray System 3. Label Printer 4. Finger Printer Recognition System Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1 kW Power Supply AC 110~220V (±10%) 50Hz Working Mode Off-line System Computer Operating System Industrial PC, Windows OS , i7
Logiciel développé par individu de compteur de puce d'Unicomp CX7000L avec l'algorithme de compte d'anti interférence
Unicomp Self-developed Software with Anti-interference Counting Algorithm CX7000L Chip Counter Technical Data of CX7000L Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1kW Power Supply AC 110~220V (±10%) 50Hz Working Mode Off-line System Computer Operating System Industrial PC, Windows OS , i7 CPU Monitor 22” LCD X-Ray Tube Max. Voltage 80 kV Max. Current 700
AX9100max Machine électronique à rayons X avec suivi à point fixe lors de l'inclinaison du FPD
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
Système de rayons X AX9100max avec des algorithmes pour la reconstruction d'images à super-résolution
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
Les cartes électroniques 2D et 2.5D machine à rayons X AX9100MAX avec table de rotation à 360 degrés pour BGA&PCB
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
Machine de tomographie par rayons X à haute résolution Unicomp UNCT3200 pour les essais non destructifs des lames du moteur
High Resolution X-Ray Tomography Machine Unicomp UNCT3200 For Engine Blades Non-Destructive Testing Product Description: The UNCT3200 industrial CT testing apparatus employs a vertical, double-column design supported by a high-precision monolithic marble base. Equipped with a high-power split X-ray tube and a large-format flat panel detector, it caters to diverse customer inspection requirements. This comprehensive inspection system encompasses capabilities such as material
Mesure de courbure IC Unicomp AX9100MAX Machine à rayons X avec taille de pixel de 84 μm et angle d'inclinaison de 60 °
It is widely utilized in applications such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, Photovoltaic Industry, and more. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray
Unicomp AX9100max Machine à rayons X 220AC 50Hz pour l'escalade en étain
Unicomp AX9100max X-ray Machine For Tin Climbing The Unicomp AX9100max X-ray Machine is specifically designed for tin climbing applications, offering advanced inspection capabilities for various industries. Application Fields Widely applied for: BGA, CSP, Flip Chip LED, Fuse, Diode PCB, Semiconductor Battery Industry Small Metal Casting Electronic Connector Module Cables Photovoltaic Industry Application fields of Unicomp X-ray AX9100max Functions and Features Functions and
La machine à rayons X Unicomp AX9100max 130kV 65W pour le BGA
Unicomp AX9100max X-ray Machine 130kV 65W FOR BGA The Unicomp AX9100max X-ray Machine is designed for IGBT inspection and widely applied in various industries including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Application fields of Unicomp AX9100max X-ray Machine Functions and Features Functions and features of Unicomp AX9100max X-ray
