electronics x ray system
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Haute machine efficace d'inspection de BGA X Ray, systèmes micro de Cabinet du foyer X Ray
Micro-focus x-ray cabinet systems BGA X-Ray Inspection Machine Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection Area 200mm x 200mm Oblique Angle Views 360° rotary fixture (Optional) X-ray Leakage
Haute résolution en ligne de machine d'inspection de BGA X Ray avec le générateur intégré
Online BGA inspection system with integrated generator X-Ray Inspection Machine OUR SERVICE 1.Your inquiry will be replied in 12 hours. 2.Original Manufacture to customers, with competitive price. 3.We provide one year warranty, free training and whole life technology support. 4.We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you, and will give you the tracking NO. after shipment. 5.Well-trained and Professional after-sales service team to support you.
99,9% plateau de X Ray Chip Counter For Quad Reel/JEDEC/paquet de grande précision de tube
Over 99.9% high accuracy One-button operation of X-ray Chip Counter for quad reel, JEDEC tray , Tube package Main Configuration of Chip Counter 1. Bar-code Scanner 2. X-ray System 3. Label Printer 4. Finger Printer Recognition System Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1kW Power Supply AC 110~220V (±10%) 50Hz Working Mode Off-line System Computer
SMD composant X Ray Counter Machine CX7000L avec l'AI dynamique comptant l'algorithme
Free Component library with dynamic AI Counting algorithm of SMD X-ray Chip Counter CX7000L Main Configuration of Chip Counter CX7000L 1. Bar-code Scanner 2. X-ray System 3. Label Printer 4. Finger Printer Recognition System Technical Data of CX7000L Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1kW Power Supply AC 110~220V (±10%) 50Hz Working Mode Off-line
Extérieur intelligent complètement automatique de nuage d'Unicomp X Ray Chip Counter CX7000L pour le composant
Unicomp fully automatic Intelligent X-ray Chip Counter CX7000L for component counting with Cloud of Remote support Technical Data of CX7000L Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1kW Power Supply AC 110~220V (±10%) 50Hz Working Mode Off-line System Computer Operating System Industrial PC, Windows OS , i7 CPU Monitor 22” LCD X-Ray Tube Max. Voltage 80
Compteur automatique de puce de l'inspection X Ray de CX7000L se reliant à l'ERP WMS de MES
Rich Experience On Connecting With MES, ERP and WMS of Chip Counter CX7000L Technical Data of CX7000L Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1kW Power Supply AC 110~220V (±10%) 50Hz Working Mode Off-line System Computer Operating System Industrial PC, Windows OS , i7 CPU Monitor 22” LCD X-Ray Tube Max. Voltage 80 kV Max. Current 700 μA Focal Spot Size
Chaîne de production en ligne équipement en temps réel de X Ray, essai de la radiographie NDT de 160KV X Ray
Online Production Line Real Time X Ray Inspection Equipment System 160KV Whether in the automotive, electronics or aircraft industry or for ship and vessel construction, Unicomp Technology is offering industrial X-ray inspection systems for nondestructive material testing which can fit in any manufacturing process and guarantee highest quality and safety standards for industrial products. 1. Full cycle support from products design to testing procedures and high-quality
Puissance du système AX8200 0.8kW de machine d'inspection du semi-conducteur BGA X Ray de SME
EMS Semiconductor BGA X Ray Inspection Machine System AX8200 Features: ● 100KV 5μm X-ray tube, image intensifier with 2 mega pixels CCD camera. ● Motion controls include: ±60° tilt motion, X/Y table motion plus Z axis tube and detector movement. ● Multi-function DXI image processing system ● X/Y programming function for multiple image inspection routines ● Max. loading area 510mm x 420mm, max. detection area 435 x 385mm with ~300X System Magnification. ItemDefinitionSpecsSyst
Défauts de moulage du moulage d'aluminium X Ray Inspection Machine For Cavities
Cavities Casting defects Metal X Ray Machine Industrial Quality Management Unicomp Technology automated x-ray systems inspect steel or aluminum alloy castings expressly for the automotive industry. The automated radioscopic inspection of aluminum die castings can be performed for an audit-based or production-level scale. Inspection System for Die Casting, Automotive Components, Defense Components, Cultural Assets and Large Products Appropriate for medium•large size component
