bga x ray inspection system
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Flip Chip Unicomp Electronics de haute résolution X Ray Machine AX8200
Electronics X-Ray Unicomp AX8200 Machine With Direct Factory PriceThe AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework operation.
Unicomp AX8200B 100kv X Ray Scanner Machine 5μM For Diamond Core Drill Bit
X-ray Inspection for Diamond core drill bit inner distance measurement by Unicomp AX8200B Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This
CSP AX8200B X Ray Detect Equipment 0.8KW pour Diamond Core Drill Bit
Factory price high quality AX8200B X-RAY inspection for diamond core drill bit inner dimension measurement Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing
Machine d'inspection à rayons X électronique commune de soudure d'inclinaison BGA AX8300MAX Unicomp, analyse automatique des vides
Tilt BGA Solder Joint Electronics X-ray Inspection Machine AX8300MAX Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Applications This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and other special industrial components. Key Features Professional
Machine de Benchtop X Ray de laboratoire pour la LED/puce à protubérance/semi-conducteur
Laboratory Benchtop X Ray Machine for PCB , LED , Flip Chip , Semiconductor Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection Area 200mm x 200mm Oblique Angle Views 360° rotary fixture (Optional) X-ray
En aluminium la détection programmable de commande numérique par ordinateur de machine de SMT de moulage mécanique sous pression/SME X Ray pour des vides de BGA
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. SMT, BGA, CSP, Flip Chip, LED Detection Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing system, CNC programmable detection 130kV (Option 110KV) 3µm closed X-ray tube, high speed &
Équipement gris de détection d'Unicomp X Ray, machine nulle d'inspection de BGA 220AC/50Hz
BGA voids inspecting machine Electronics X ray machine for SMT manufacturer The LX-2000 is a versatile OnLine X-ray Machine designed for automated and semi-automated analysis. In addition to the OnLine capability, the LX-2000 can also be used in a Manual mode as a process monitoring/engineering workstation. High resolution x-ray images are generated using a closed microfocus 130kV tube with leading edge FPD (Flat Panel Display) detectors. This imaging chain combination is
Système élevé de l'électronique X Ray de rapport optique pour l'inspection de vide de BGA CSP/QFN/PoP
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing
Boule de golf de machine de l'électronique X Ray d'inspection de la carte PCB BGA à l'intérieur de la vérification de qualité
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement Multi-function DXI image processing system, CNC programmable
