automatic x ray machine
"
Mesure en différé d'AX8200Max SMT SME X Ray Machine Auto Mapping
Offline AX8200Max SMT EMS X Ray Machine Auto Mapping Measurement Unicomp offline AX8200Max X-ray with auto-mapping and measurement for BGA QFN LED soldering Void Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot
Carte PCB X Ray Machine 90kV d'AX8200max avec la fonction d'incliner ±60° pour l'effet d'inspection
90kV maintanence free closed tube SMT X-Ray machine Unicomp AX8200MAX for BGA LED soldering voids measurement Application Fields of SMT X-Ray machine Unicomp AX8200MAX BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, Other Special Industries. Function & Features of X-ray machie 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive
Machine de radiographie numérique NDT UNC450 machine à rayons X Unicomp pour tester la prosité des pièces de rechange automobiles
NDT digital radiagraphy UNC450 Unicomp X-ray machine for testing automotive spare part prosity Product Description: This specialized equipment is primarily used for non-destructive testing across a wide variety of materials and products. It is extensively applied in inspecting metal castings to guarantee the structural integrity of intricate metal components, as well as hardware products that range from nuts and bolts to precision-machined parts. Manufacturers also benefit
En aluminium la détection programmable de commande numérique par ordinateur de machine de SMT de moulage mécanique sous pression/SME X Ray pour des vides de BGA
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. SMT, BGA, CSP, Flip Chip, LED Detection Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing system, CNC programmable detection 130kV (Option 110KV) 3µm closed X-ray tube, high speed &
Analyse de l'électronique intégrée X Ray Machine LX2000 FPC de SPC pour la soudure de BGA QFN
Fully automatic Inspection and Analysing Inline AXI LX2000 X-ray for BGA , QFN soldering void inspection one FPC Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor) Packing Weight 2000kg (X-Ray) / 800kg (Conveyor) Power Consumption 3.5 kW X-Ray Tube Tube Type Sealed Max.
IP66 réjecteur automatique X Ray Machine For Food Industry UNX4015N
IP66 Auto Rejector X Ray Machine For Food Industry UNX4015N Food X-Ray Inspection for checking dry pack food contamination with auto rejector Technical Specifications of Food Xray machine Equipment Features Dimension 1168(W)X985(D)X1510(H)mm Machine weight 500kg X-ray tube 80-120kv/210-480W Power Supply AC 110/220V, 50/60Hz Max. Loading weight 10kg X-ray detector Diode array with 0.4mm resolution Channel size 400mm(W)*150mm(H) Conveyor Speed 10-60M/min Heavy load Conveyor
Machine à rayons X à 160 KV Unicomp UNC450 pour les pièces de coulée automobile à cylindre
160KV X-ray machine Unicomp UNC450 for cylinder automotive casting parts non-destructive testing Product Description: This specialized equipment is primarily utilized for conducting non-destructive testing across a diverse range of materials and products. It finds extensive application in examining metal castings to ensure the integrity of intricate metal structures, as well as hardware products ranging from nuts and bolts to precision-engineered machinery parts. Plastic
Machine à rayons X à haute magnification Unicomp AX7900 pour l'inspection de la qualité des téléphones portables usagés
High magnifications X-ray machine Unicomp AX7900 for used mobile phone quality inspection Description of IC X Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. FEATURES of IC Xray machine AX7900: Large Size Inspection Table Laser Pinpoint For Precise Location Accurate Control, CNC Programming Automatic
SMT PCB Machine à rayons X haute résolution Micron Focus Spot Taille Unicomp AX7900 Pour l'inspection de la qualité et des fissures à l'intérieur du téléphone portable
SMT PCB X-ray machine high resolution micron focus spot size Unicomp AX7900 for cellphone inside quality and cracks inspection Description of IC X Ray machine AX7900: It finds extensive application across multiple sectors such as BGA, CSP, Flip Chip technology, LEDs, Fuses, Diodes, PCBs, Semiconductors, the Battery Industry, small-scale metal casting, electronic connector modules, cables, aerospace components, and the Photovoltaic Industry, among others. FEATURES of IC Xray
