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Unicomp AX8300MAX 110KV X-ray Inspection for BGA One-Click Automated Void Detection

Propriétés de base
Lieu d'origine: Chine
Nom de la marque: UNICOMP
Attestation: CE, FDA
Numéro de modèle: AX8300MAX
Propriétés commerciales
Quantité minimum de commande: 1 ensemble
Prix: can negotiate
Conditions de paiement: T/T, L/C
Capacité d'approvisionnement: 30 ensembles par mois
Résumé du produit
Unicomp AX8300MAX 110KV X-ray Inspection System Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Features 60° tilt and 360° rotary stage for BGA and HIP (Head-In-Pillow) inspection. Applications This system is widely applicable ...

Détails du produit

Mettre en évidence:

Unicomp AX8300MAX X-ray inspection machine

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BGA automated void detection X-ray

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110KV X-ray machine for electronics

Motion Control Mode: Souris et Clavier et Manette
Tilt And Rotation: Inclinaison unilatérale du détecteur maximum 60°
Monitor: Écran HD 4K de 27 pouces
System OS: Windows11 64 bits
Power Consumption: 900W
Description du produit
Unicomp AX8300MAX 110KV X-ray Inspection System Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Features 60° tilt and 360° rotary stage for BGA and HIP (Head-In-Pillow) inspection. Applications This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and
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