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110KV X-ray Inspection for BGA with AI-Powered Automatic Void Detection Unicomp AX8300MAX

Propriétés de base
Lieu d'origine: Chine
Nom de la marque: UNICOMP
Attestation: CE, FDA
Numéro de modèle: AX8300MAX
Propriétés commerciales
Quantité minimum de commande: 1 ensemble
Prix: can negotiate
Conditions de paiement: T/T, L/C
Capacité d'approvisionnement: 30 ensembles par mois
Résumé du produit
UNICOMP AX8300MAX X-ray Inspection System Advanced 110KV industrial X-ray inspection system with AI-powered automatic void detection, specifically designed for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. ...

Détails du produit

Mettre en évidence:

110KV X-ray BGA inspection machine

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AI-powered automatic void detection X-ray

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Unicomp AX8300MAX X-ray electronics

Model: AX8300MAX
Motion Control Mode: Souris et Clavier et Manette
Tilt And Rotation: Inclinaison unilatérale du détecteur maximum 60°
Monitor: Écran HD 4K de 27 pouces
System OS: Windows11 64 bits
Power Consumption: 900W
Tube Type: Scellé
Description du produit
UNICOMP AX8300MAX X-ray Inspection System Advanced 110KV industrial X-ray inspection system with AI-powered automatic void detection, specifically designed for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection system is extensively deployed for quality verification of semiconductor packaging devices including BGA, CSP, LED and flip chip, automotive electronic
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