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Multi‑mode 3D Reconstruction PCBA BGA Solder Joint X‑ray Inspection Machine AX9500 Unicomp Inspection Tester

Propriétés de base
Lieu d'origine: Chine
Nom de la marque: UNICOMP
Attestation: CE, FDA
Numéro de modèle: AX9500
Propriétés commerciales
Quantité minimum de commande: 1 ensemble
Prix: can negotiate
Conditions de paiement: T/T, L/C
Capacité d'approvisionnement: 300 ensembles par mois
Résumé du produit
Multi-mode 3D Reconstruction PCBA BGA Solder Joint X-ray Inspection Machine AX9500 Unicomp Inspection Tester High-precision CT machine AX9500 UNICOMP X-Ray Computed Tomography System for Accurate PCB and BGA Inspection Product Overview Fully upgraded new products featuring advanced CT detection ...

Détails du produit

Mettre en évidence:

Multi-mode 3D X-ray inspection machine

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BGA solder joint X-ray tester

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PCBA X-ray inspection machine with warranty

Name: Machine d'inspection de rayon X d'Unicomp
Application: SMT, SME, BGA, l'électronique, CSP, LED, Flip Chip, semi-conducteur
Industry: Industrie électronique
X-Ray Leakage: < 1uSv="">
Description du produit
Multi-mode 3D Reconstruction PCBA BGA Solder Joint X-ray Inspection Machine AX9500 Unicomp Inspection Tester High-precision CT machine AX9500 UNICOMP X-Ray Computed Tomography System for Accurate PCB and BGA Inspection Product Overview Fully upgraded new products featuring advanced CT detection capabilities for BGA, CSP, flip chips, LEDs and other semiconductors. Ideal for SMT welding analysis with comprehensive 3D tomography CT scanning system (planar CT + cone beam CT).
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