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High‑definition FPD Detector BGA Head‑In‑Pillow Defect AX9500 Unicomp SMT Welding Analysis System

Propriétés de base
Lieu d'origine: Chine
Nom de la marque: UNICOMP
Attestation: CE, FDA
Numéro de modèle: AX9500
Propriétés commerciales
Quantité minimum de commande: 1 ensemble
Prix: can negotiate
Conditions de paiement: T/T, L/C
Capacité d'approvisionnement: 300 ensembles par mois
Résumé du produit
High-definition FPD Detector BGA Head-In-Pillow Defect AX9500 Unicomp SMT Welding Analysis System The AX9500 UNICOMP X-Ray Computed Tomography System delivers high-precision CT inspection for accurate PCB and BGA analysis. This fully upgraded system performs comprehensive CT detection on BGA, CSP, ...

Détails du produit

Mettre en évidence:

FPD detector BGA defect analysis

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Unicomp SMT welding system

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X-ray head-in-pillow inspection

Name: Machine d'inspection de rayon X d'Unicomp
Application: SMT, SME, BGA, l'électronique, CSP, LED, Flip Chip, semi-conducteur
Industry: Industrie électronique
X-Ray Leakage: < 1uSv="">
Description du produit
High-definition FPD Detector BGA Head-In-Pillow Defect AX9500 Unicomp SMT Welding Analysis System The AX9500 UNICOMP X-Ray Computed Tomography System delivers high-precision CT inspection for accurate PCB and BGA analysis. This fully upgraded system performs comprehensive CT detection on BGA, CSP, flip chips, LEDs, and other semiconductors, plus SMT welding analysis with advanced 3D tomography CT scanning capabilities. Applications Semiconductor industry inspection SMT
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