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High Precision BGA Solder Joint Xray Quality Control System AX8300 Unicomp Equipment

Propriétés de base
Lieu d'origine: Chine
Nom de la marque: UNICOMP
Attestation: CE, FDA
Numéro de modèle: AX8300
Propriétés commerciales
Quantité minimum de commande: 1 ensemble
Prix: can negotiate
Conditions de paiement: T/T, L/C
Capacité d'approvisionnement: 30 ensembles par mois
Résumé du produit
High Precision BGA Solder Joint X-ray Quality Control System AX8300 The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray ...

Détails du produit

Mettre en évidence:

BGA solder joint Xray system

,

High precision Xray quality control

,

Unicomp Xray machine equipment

Product Name: AX8300
Dimension: 1215*1325*1700(mm)
Power Supply: 220V,50Hz/60Hz 4A
Weight: 1350 kg
Voltage: 110kV
Warranty: 1 an
Description du produit
High Precision BGA Solder Joint X-ray Quality Control System AX8300 The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to solve insufficient penetration of 90kV
Notation globale
5.0
★★★★★
★★★★★
Basé sur 50 critiques récemment
cinq étoiles
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  • J
    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE
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