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Auto Void Detection Xray Machine AX8300 High Motion Precision BGA Solder Joint Testing Equipment Unicomp

Propriétés de base
Lieu d'origine: Chine
Nom de la marque: UNICOMP
Attestation: CE, FDA
Numéro de modèle: AX8300
Propriétés commerciales
Quantité minimum de commande: 1 ensemble
Prix: can negotiate
Conditions de paiement: T/T, L/C
Capacité d'approvisionnement: 30 ensembles par mois
Résumé du produit
Auto Void Detection X-ray Machine AX8300 High Motion Precision BGA Solder Joint Testing Equipment by Unicomp The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring ...

Détails du produit

Mettre en évidence:

Auto Void Detection Xray Machine

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BGA Solder Joint Testing Equipment

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High Motion Precision Xray Machine

Product Name: AX8300
Dimension: 1215*1325*1700(mm)
Power Supply: 220V,50Hz/60Hz 4A
Weight: 1350 kg
Voltage: 110kV
Warranty: 1 an
Description du produit
Auto Void Detection X-ray Machine AX8300 High Motion Precision BGA Solder Joint Testing Equipment by Unicomp The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to
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5.0
★★★★★
★★★★★
Basé sur 50 critiques récemment
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  • J
    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE
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