Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
Propriétés de base
Lieu d'origine:
Chine
Nom de la marque:
UNICOMP
Attestation:
CE, FDA
Numéro de modèle:
AX9100 max
Propriétés commerciales
Quantité minimum de commande:
1 ensemble
Prix:
can negotiate
Conditions de paiement:
LC, T/T
Capacité d'approvisionnement:
100set/montrh
Résumé du produit
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse ...
Détails du produit
Mettre en évidence:
Unicomp AX9100max X-ray inspection system
,Flip-Chip BGA X-ray machine
,FCBGA packaging analysis equipment
Monitor:
Écran HD 27"
System OS:
Windows10 64 bits
Hard Disk:
1TB
RAM:
16g
CPU Model:
I7
Description du produit
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including:
- BGA/CSP/Flip Chip packaging
- LED & optoelectronic components
- Fuse & diode manufacturing
- PCB & semiconductor assembly
- Battery production
- Small metal castings
- Electronic connector modules & cables
- Photovoltaic (PV) cell inspection
Application Fields
Application fields of Unicomp AX9100max X-ray Machine
Functions and Features
Functions and features of Unicomp AX9100max X-ray Machine
Inspection Image
Sample inspection image from Unicomp AX9100max X-ray Machine
Technical Parameters and Specifications
Technical specifications of Unicomp AX9100max X-ray Machine
Dimensions and Appearance
Dimensions and appearance of Unicomp AX9100max X-ray Machine
Notation globale
cinq étoiles
100%
4 étoiles
0
3 étoiles
0
2 étoiles
0
1 étoile
0
Toutes les critiques
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TIt's useful for our product.
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JGood!
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SStable product quality , reliable cooperation partner
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