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Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis

Propriétés de base
Lieu d'origine: Chine
Nom de la marque: UNICOMP
Attestation: CE, FDA
Numéro de modèle: AX9100 max
Propriétés commerciales
Quantité minimum de commande: 1 ensemble
Prix: can negotiate
Conditions de paiement: LC, T/T
Capacité d'approvisionnement: 100set/montrh
Résumé du produit
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse ...

Détails du produit

Mettre en évidence:

Unicomp AX9100max X-ray inspection system

,

Flip-Chip BGA X-ray machine

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FCBGA packaging analysis equipment

Monitor: Écran HD 27"
System OS: Windows10 64 bits
Hard Disk: 1TB
RAM: 16g
CPU Model: I7
Description du produit
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic connector modules & cables Photovoltaic (PV) cell inspection Application
Notation globale
5.0
★★★★★
★★★★★
Basé sur 50 critiques récemment
cinq étoiles
100%
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Toutes les critiques
  • J
    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE
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