x ray metal inspection
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Équipement à rayons X NDT de la série UNC DR avec détecteur de silicium amorphe et empreinte de 2600*2784*2440 mm
UNC Series NDT X-Ray Equipment (DR) Product Description: Mainly used in metal castings, hardware products, plastic products, refractory materials, resin materials, composite materials, ceramic body and welding metal parts and other small products for non-destructive testing. Features: Wide range of applications to meet the inspection of multiple sizes and types of products. Low failure rate, best-selling equipment for 9 years High Safety: High level protection, radiation dose
Équipement d'inspection par rayons X avec conception de tube scellé
X-Ray Inspection Equipment Product Description: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Features: Large Size Inspection Table. Laser Pinpoint For Precise LocationLarge Size Inspection Accurate Control, CNC Programming Automatic Positioning FPD Tilting ±25° Safely Electromagnetic Interlock Fingerprint Access
Le système d'inspection automatique de la nourriture X Ray Unicomp 10m minimum avec le rejet automatique pièce
Unicomp Automatic Food X-Ray Inspection System with auto rejection part, Detection for Metal, Stone Specifications: Model UNF6040 Max Voltage 40-120kV Max Current 0.2-7.5mA Inspection Speed (m/min) 10-50 Inspection Accuracy(mm) Stainless steel ball ø0.5,Stainless steel wire 0.2x1.5, Glass2.0,Plastic 1.5 Image system Linear detector array Belt Food grade belt, length can be customized Tunnel Size(mm) 600x400 Max.Loading Weight 10kg Monitor 19' Dimension(WxDxH,mm) 1600x790x1800
Tube 100KV X Ray Scanner AX8200 de Finefocus pour l'inspection de PCBA
X-Ray Inspection Machine Electronics BGA Standard Multifunction Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Applications:BGA , CSP , LED , Flip Chip , Semiconductor,Battery Industry , Small Metal Casting,Electronic Connector Module,Aerospace Components , Photovoltaic Industry,Other Special Industries. Technical Data
Machine d'inspection de la nourriture X Ray d'Unicomp pour le criblage en verre en métal en pierre de matière étrangère
Unicomp X-ray inspection machine for food packages of Foreign Material Stone, Glas, Metal Screening Applications of Food Xray UNX6030N UNX6030-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Technical Specifications of Food Xray UNX6030N Equipment Features Dimension 1500(W
160KV 3D Computed Tomography X-Ray Machine Unicomp UNCT3100 For Automotive Casting Parts Non-Destructive Testing
160KV 3D computed tomography X-ray machine Unicomp UNCT3100 for automotive casting parts non-destructive testing Product Description: The UNCT3100 is one compact industrial CT inspection system that offers high precision and can be utilized across various industries to meet their specific inspection requirements. It is primarily employed for small metal castings, non-ferrous metals, lithium battery cells, chips, electronic components, rock samples, cores, soils, fossils,
Unicomp UNX3015-S Radiographie avancée pour la détection des os de pierre métalliques
Unicomp UNX3015-S good performance detect metal stone bones ceramic from ham Product Description: Our advanced X-ray technology for contaminant detection within packaged foods has ushered in a new era of quality assurance, encompassing a diverse range of products from ready-to-eat meals and frozen goods to freshly sliced fruits and vegetables, not to mention snack items. This innovative system effortlessly penetrates packaging barriers, promptly identifying any unwanted
Équipement 160KV en métal NDT X Ray de faible densité avec l'interface du logiciel conviviale
Low Density Metal Nondestructive Material Testing NDT X Ray 160KV Unicomp Technology UNC series NDT X ray real time imaging detection equipment is the standardized one for industrial NDT. Unicomp has rich experience in the design of NDT X-ray and solution of detection technology to help customers to achieve non-destructive testing in manufacturing process, research, project development and testing services, and ensure product quality. The technology and equipment are widely
Poutre simple Unicomp X Ray Stainless Steel Ball 40-120kV avec le logiciel
Max Voltage: 40-120kV Max Current: 0.2-7.5mA Dimension(WxDxH,mm): 1600x790x1800 Weight: 500kg Inspection Accuracy(mm): Stainless Steel Ball ø0.5,Stainless Steel Wire 0.2x1.5, Glass2.0,Plastic 1.5 Safety:
