x ray inspection system
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Système CT 3D haute résolution 450KV Unicomp UNCT3200 pour aubes de moteur, analyse de la porosité des pièces moulées
Unicomp UNCT3200 High-Resolution 450KV 3D CT System for engine blades Castings porosity analysis NDT Quality Inspection For Precision Turbine Blade Porosity Analysis Product Specifications Attribute Value Maximum tube voltage 450kV Focal size (EN 12543) d=0.4mm/d=1.0mm Maximum detected weight 100kg Imaging area ≤430mm×430mm Product Overview The UNCT3200 industrial CT testing machine features a vertical twin-column design with a high-precision, solid marble base. Equipped with
Échangeurs de chaleur à barres et à plaques NDT CT UNCT2600
Bar and Plate Heat Exchangers NDT CT UNCT2600 Features: Functions: DR And CT dual imaging detection function; 3D scanning, data reconstruction and analysis. Safety: High level protection, radiation dose far lower than the national standard; multiple security measures. Operation: User-friendly design of the control system, easy to operate, after a short training can be mastered. Precision: High-precision mechanical transmission system, advanced image processing and analysis
Unicomp UNCT3200 Système de tomodensitométrie 3D haute résolution 450KV pour l'analyse de la porosité des lames de moteur
Unicomp UNCT3200 High-Resolution 450KV 3D CT/Computed Tomography System for Engine Blades Castings Porosity Analysis Product Overview UNCT3200 is a self-shielded, multi-purpose industrial CT computed tomography system designed to accommodate workpieces of various sizes and materials. This system meets industrial CT application demands across diverse industries and is specially engineered for high-precision inspection of medium and large products, including metal castings, non
Tube scellé 110kV, composant semi-conducteur IC de haute précision, équipement à rayons X, contrôle de qualité Unicomp AX8300MAX
110kV Sealed Tube High Precision IC Semiconductor Component Xray Equipment AX8300MAX Unicomp Quality Control Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 5 µm 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual
Système à rayons X Unicomp AX7900 90KV 2D pour une détection précise des vides BGA
Unicomp AX7900 90KV 2D X-ray System for Accurate BGA Void Detection Description of BGA X-Ray machine AX7900: Equipped with 90kV / 5μm micro-focus X-ray tube and high-performance FPD detector, AX7900 adopts a multifunctional workstation design. It features standard XY multi-axis motion with optional ±60° tilt. Independent Z-axis movement of X-ray tube and FPD allows flexible adjustment of magnification and FOV. Integrated with target positioning system and professional DXI
Production d'ERP 1.1kW SMD Chip Components Counter For SMT
Features ● Automatic inspection, no need on programs switch for different components ● Fast speed and high accurate chip counting, reducing labor costs ● No chip damage or lost with non-destructive counting ● Compatible with 7”~17” tape & reels ● Automatic link with ERP & MES System, and storage system ● Shielded cabinet protection to guarantee Safety leakage of X-ray ● Fast counting Speed:12~13s/Reel ● Inspection Accuracy: ≥99.9% ● Min. Package: 01005 ● One-button operation,
Machine d'inspection à rayons X de l'électronique de semi-conducteur d'IC de tube scellée par 5μm 110kV haute précision AX8300 Unicomp
5μm 110kV Sealed Tube IC Semiconductor Electronics Xray Inspection Machine AX8300 Unicomp High Precision AX8300 is purpose-built to fulfill high-precision inspection needs for PCBA manufacturing. It features an innovative 110kV micro-focus X-ray source, uniquely developed to bridge the performance gap between standard 90kV and 130kV systems. It delivers balanced penetration power, perfectly suited for scenarios where 90kV is insufficient and 130kV is overly powerful. Powered
Système d'inspection d'assemblage de PCB à rayons X AX9600 Unicomp SMT, détection de vide BGA PCBA BGA à imagerie claire
Clear Imaging BGA Void Detection PCBA BGA X-ray AX9600 Unicomp SMT PCB Assembly Inspection System UNICOMP AX9600 adopts an in-house developed 160kV high-power open micro-focus X-ray tube with an ultra-fine 0.8μm focal spot. It supports magnification up to 2000× and offers superior X-ray penetration, enabling precise void content measurement for TVS diodes. Optimized for high-end semiconductor inspection, it caters to high-precision quality control of advanced IC packaging,
99,8% vitesse rapide de l'exactitude X Ray d'inspection contre- avec la capacité 01005 de compte
Electronic Components Counting System Production Line X-ray Counter LX6000 Manual component counting requires hours and includes the possibility of miscounts resulting in machine down-time, inaccurate inventory management, and ultimately reduced profit margins. Seamless and flexible automation means more up-time on the assembly line and increased productivity. Component counting using Unicomp X-Ray technology can take only seconds for an entire reel. Increase productivity
