x ray imaging system
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Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA)
Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA) The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode ...
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse ...
Unicomp AX9100max X-ray Machine 130kV For IGBT Testing
Unicomp AX9100max X-ray Machine 130kV For IGBT Testing The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and finds broad application across industries such as BGA/CSP/Flip Chip packaging, LED and optoelectronic component manufacturing, fuse and diode ...
Unicomp AX9100max X-ray Machine For Cylindrical Power Cell
Unicomp AX9100max X-ray Machine For Cylindrical Power Cell Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Application fields of Unicomp X-ray ...
Unicomp AX9100max X-ray Machine For EV Cylindrical Cell
Unicomp AX9100max X-ray Machine For EV Cylindrical Cell The Unicomp AX9100max X-ray Machine is designed for EV Cylindrical Cell inspection and is widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, ...
Unicomp AX9100max Electronics X Ray Machine FOR Ball Grid Array
Unicomp AX9100max Electronics X Ray Machine FOR Ball Grid Array The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing ...
Inspection en acier de cylindre de grand de pièces équipement universel lourd des soudures NDT X Ray
Inspection en acier de cylindre de grand de pièces équipement universel lourd des soudures NDT X Ray Un défi spécial dans l'inspection des pièces lourdes et grandes est la partie-manipulation difficile. Une solution efficace augmente la sortie tout en réduisant les coûts. Pour fournir la solution la ...
équipement intégré intelligent industriel de détection de 480W NDT X Ray Machine 160kV
Équipement intégré intelligent de détection de rayon X industriel efficace de haute résolution de NDT Spécifications techniques Dimensionne le ●Weight 2100mm*1720mm*2470mm (●6Tde L*W*H) Puissance 6KW Vitesse de détection 45s/pcs (18' “roue) Tension de tube/taille focale 160kV/225kV ● 0.5mm/1.0mm ...
Système industriel de rayon X d'Unicomp NDT pour la détection de moulage de failles de pièces d'auto de fer de moulage d'aluminium
Système à rayons X industriel Unicomp NDT pour la détection des défauts de pièces automobiles en fonte d'aluminium L'UNC225 est un système d'inspection par rayons X industriel robuste et fiable pour de nombreuses applications dans les fonderies, la R&D, les laboratoires, les universités et les ...
