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real time x ray system

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Qualité CSP BGA X Ray Scanner Machine 100KV FPD Microfocus a fermé le tube AX8500 Usine

CSP BGA X Ray Scanner Machine 100KV FPD Microfocus a fermé le tube AX8500

High resolution FPD with microfocus closed tube AX8500 X-ray system from Unicomp for LED inner bubble and void testing Technical Parameters and Specifications System SummaryFootprint1370(W)×1300(D)×1700(H)mmMachine Weight1600 kgPower SupplyAC 110~220V, 50/60HzPlywood Packing Size1750(W)×1500(D)×2000(H)mmPacking Weight1800 kgPower Consumption2.0 kWX-Ray TubeTube TypeSealedMax. Power25WVoltage0~110kV (Adjustable)Focus Spot Size5μmImaging SystemDetectorFlat Panel Detector (FPD

Qualité L'électronique X Ray Machine 5um AX8500 du semi-conducteur 110kV pour PCBA BGA Usine

L'électronique X Ray Machine 5um AX8500 du semi-conducteur 110kV pour PCBA BGA

110kV 5um Microfocus X Ray Machine with high resolution FPD AX8500 For PCBA BGA void Inspection Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)

Qualité Soudure d'Unicomp AX8500 X Ray Inspection Machine For SMT SME BGA LED CSP QFN Usine

Soudure d'Unicomp AX8500 X Ray Inspection Machine For SMT SME BGA LED CSP QFN

Unicomp AX8500 X-ray inspection machine for SMT / EMS BGA LED CSP QFN soldering void measurement​ Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector

Qualité commande numérique par ordinateur de 5um SMT X Ray Equipment programmable pour des vides de SME BGA Usine

commande numérique par ordinateur de 5um SMT X Ray Equipment programmable pour des vides de SME BGA

5um Microfocus X Ray Machine with CNC Programmable inspection For SMT EMS BGA Voids checking Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)

Qualité L'électronique X Ray Machine 110kV Unicomp AX8500 de CSP SMT pour SMT PCBA BGA QFN Usine

L'électronique X Ray Machine 110kV Unicomp AX8500 de CSP SMT pour SMT PCBA BGA QFN

Unicomp 2D AX8500 110kV Closed Tube X-ray for SMT PCBA BGA QFN soldering void measurement Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel

Qualité Puce AX8500 de CSP LED X Ray Machine Closed Tube Flip pour le semi-conducteur 100KV Usine

Puce AX8500 de CSP LED X Ray Machine Closed Tube Flip pour le semi-conducteur 100KV

Closed Tube Type AX8500 X Ray Machine for semiconductor Lead frame wiring bonding quality inspection Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector

Qualité Rapport optique Unicomp AX8500 de l'électronique X Ray Machine FPD 1000X de SMT BGA Usine

Rapport optique Unicomp AX8500 de l'électronique X Ray Machine FPD 1000X de SMT BGA

Unicomp AX8500 X Ray with FPD Detector and 1000X Magnification to check Semiconductor components quality issue Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel

Qualité Haute machine intégrée de rayon de la machine 3D CT de pénétration pour la carte PCB examinant Unicomp LX9200 Usine

Haute machine intégrée de rayon de la machine 3D CT de pénétration pour la carte PCB examinant Unicomp LX9200

High penetration inline 3D CT machine X-Ray machine for PCB testing Unicomp LX9200 with real-time display Unicomp Technology 3D Inline X-ray Inspection Equipment——LX9200 As a new generation of upgraded and optimized LX9200 online inspection equipment, it can easily meet the multi-directional and multi-angle product inspection needs of different users. Application Field SMT/PCBA Package type:BGA,LGA,CSP,POP,SIP... Defect type:Void,HIP,Insufficient,Bridge... Semiconductor

Qualité Machine à rayons X NDT de qualité Unicomp UNC225 avec norme ASTM EN12543 pour les essais de défauts d'amortisseur Usine

Machine à rayons X NDT de qualité Unicomp UNC225 avec norme ASTM EN12543 pour les essais de défauts d'amortisseur

Engine Blocks Brake Caliper Industrial Real Time X Ray Inspection Equipment Whether in the automotive, electronics or aircraft industry or for ship and vessel construction, Unicomp Technology is offering industrial X-ray inspection systems for nondestructive material testing which can fit in any manufacturing process and guarantee highest quality and safety standards for industrial products. 1. Full cycle support from products design to testing procedures and high-quality