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pcb x ray inspection

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Qualité Commande numérique par ordinateur de BGA QFN CSP X Ray Equipment LX2000 programmable pour la soudure de FPC SMT Usine

Commande numérique par ordinateur de BGA QFN CSP X Ray Equipment LX2000 programmable pour la soudure de FPC SMT

LX2000 inline x-ray equipment with CNC programmable inspection for FPC SMT soldering process of BGA , QFN, CSP parts Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor) Packing Weight 2000kg (X-Ray) / 800kg (Conveyor) Power Consumption 3.5 kW X-Ray Tube Tube Type Sealed

Qualité CSP 130kV X Ray Security Scanner Auto Inspection pour le NDT en céramique Usine

CSP 130kV X Ray Security Scanner Auto Inspection pour le NDT en céramique

130kV clsoed tube X-ray system with convenient mapping process for ceramic NDT quality testing Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor) Packing Weight 2000kg (X-Ray) / 800kg (Conveyor) Power Consumption 3.5 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage

Qualité Unicomp LX2000 CSP BGA X Ray Machine SME AXI intégré inspectent le trou d'air de Ceremic Usine

Unicomp LX2000 CSP BGA X Ray Machine SME AXI intégré inspectent le trou d'air de Ceremic

Using Unicomp LX2000 inline AXI X-ray to inspect ceremic air hole and cracks with Auto Inspection and Analysing Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor) Packing Weight 2000kg (X-Ray) / 800kg (Conveyor) Power Consumption 3.5 kW X-Ray Tube Tube Type Sealed Max.

Qualité Tube Unicomp X Ray AX7900 0.8KW de PCBA 5um pour l'Assemblée de carte PCB Usine

Tube Unicomp X Ray AX7900 0.8KW de PCBA 5um pour l'Assemblée de carte PCB

Unicomp 5um close tube AX7900 X-ray for printed circuit board assembly PCBA process quality inspection of Void Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max.

Qualité Machine numérique à rayons X en temps réel AX7900 pour l'inspection des défauts internes du condensateur Usine

Machine numérique à rayons X en temps réel AX7900 pour l'inspection des défauts internes du condensateur

Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. APPLICATION of IC Xray machine AX7900: FEATURES of IC Xray machine AX7900: Technical Specifications of AX7900 Item Definition Specs System Summary Footprint 1200

Qualité Puce AX8500 de CSP LED X Ray Machine Closed Tube Flip pour le semi-conducteur 100KV Usine

Puce AX8500 de CSP LED X Ray Machine Closed Tube Flip pour le semi-conducteur 100KV

Closed Tube Type AX8500 X Ray Machine for semiconductor Lead frame wiring bonding quality inspection Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector

Qualité Le microfocus de 90KV 5um a fermé le système d'inspection de rayon X de tube avec FPD de haute résolution pour PCBA soudant le checki nul de défauts Usine

Le microfocus de 90KV 5um a fermé le système d'inspection de rayon X de tube avec FPD de haute résolution pour PCBA soudant le checki nul de défauts

90KV 5um microfocus closed tube X-ray Inspection System with high resolution FPD for PCBA soldering void Defects checki Application Fields of X-ray machine Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features of X-ray machie 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD

Qualité Approvisionnement d'usine d'Unicomp en système d'inspection de rayon X pour l'inspection de contamination des aliments Usine

Approvisionnement d'usine d'Unicomp en système d'inspection de rayon X pour l'inspection de contamination des aliments

Unicomp factory supply of X-ray Inspection System for food contamination Inspection APPLICATION UNX4015-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Features Provide High precision automatic foreign detection, It can effectively identify metal, ceramic, glass, bone, shell

Qualité Taille de tache encapsulée de l'électronique X Ray Machine 5μm de résistance de composants Usine

Taille de tache encapsulée de l'électronique X Ray Machine 5μm de résistance de composants

Factory Manufacturing X Ray Machine 5μM For Resistance Applications Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection BGA Inspection Inspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components EMS Semiconductor Electronics X Ray Machine System for BGA and CSP