bga x ray inspection system
"
Inspection par rayons X 2,5D/3D de haute précision pour la détection des défauts BGA et PCBA UNICOMP AX8300
High-Precision 2.5D/3D X-ray Inspection for BGA & PCBA Defect Detection UNICOMP AX8300 The AX-8300 is designed to address PCBA high resolution inspection requirements. The AX-8300 is the FIRST machine in the industry to utilize a special 110kV micro focus x-ray source! This is the Perfect “In ...
Machine d'inspection des composants électroniques BGA X Ray
Online inspection system for Checking LED Semiconductor Electronic Components The X-Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much more ...
Contrôle d'accès par empreinte digitale UNICOMP à rayons X d'inspection de puce à bascule BGA à semi-conducteurs AX8300
Semiconductor BGA Flip Chip Inspection X-ray AX8300 UNICOMP Fingerprint Access Control The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV ...
Système d'inspection de rayon X de Bga de carte mère avec la région d'inspection d'extra large
Extra large inspection area and plenty of power PCB X RAY Machine for BGA The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, ...
Système de traitement d'image 65W de la machine d'inspection DXI du vide BGA X Ray autonome
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Features X-ray tube & detector automatic lifting and ...
Résolution minimale du rayon X AX8300MAX UNICOMP 5μm d'inspection de puce de secousse du semi-conducteur BGA
Semiconductor BGA Flip Chip Inspection X-ray AX8300MAX UNICOMP This advanced industrial X-ray inspection system delivers ultra-high 5μm detection resolution for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. ...
PCBA soudant la grande vitesse de machine d'inspection de BGA X Ray avec le grand Tableau témoin
Application Semiconductor, Packaging components, Battery Industry, SMT, BGA, CSP, Flip Chip, LED Detection Aluminium Die-casting, Moulding Plastic. Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Features Max. loading area 645*670mm, max. inspection area ...
Système d'inspection de SMT Bga X Ray de semi-conducteur pour la détection interne de défauts
Application Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, SMT, BGA, CSP, Flip Chip, LED Detection Electronic components, Automotive parts, Photo-voltaic, Features X-ray tube & detector automatic lifting and ...
100kV PCBA X Ray Inspection System Unicomp Electronics pour le vide/la soudure de BGA
Unicomp Electronics High Resolution PCBA X-Ray Efficient Inspection for BGA Void, Soldering Quality Specifications: Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed (100kV Optional) Power Consumption 8W Focal Spot Size 5 μm Motion range (Up and Down) 150mm Magnification ...
