Unicomp has launched its advanced BGA X-ray inspection system, designed to address quality control challenges in electronics manufacturing. The system combines cutting-edge technology with competitive pricing, offering manufacturers a comprehensive solution for detecting defects in ball grid array (BGA) packages.
The Unicomp X-ray BGA inspection system features industry-leading X-ray source and detector technology, providing clear visualization of even the smallest details in complex PCB structures.
- High-resolution imaging: Equipped with a 90-130KV X-ray tube and 7μm micro-focus spot, the system can detect minute defects within BGA solder joints. A high-speed, megapixel flat panel detector (FPD) delivers real-time magnification up to 1000x, enabling identification of common issues including cold solder joints, voids, and bridging.
- Comprehensive coverage: The system's 7-axis movement capability and 70-degree tilt function eliminate inspection blind spots, allowing thorough examination of side joints and complex stacked structures.
- Intuitive operation: Simplified one-touch operation, 2.5D image display, and offline programming capabilities enhance workflow efficiency and flexibility.
| Parameter | Specification |
|---|---|
| Dimensions (L×W×H) | 1350mm × 1250mm × 1700mm |
| Weight | 1900kg |
| Power Supply | 220VAC / 50Hz |
| Power Consumption | 1.6kW |
| X-ray Tube Type | Sealed |
| Maximum Voltage | 130kV |
| Maximum Power | 40W |
| Spot Size | 7μm |
| Detector | FPD (Flat Panel Detector) |
| Display | 22-inch LCD |
| Maximum Magnification | Up to 1600X |
| Maximum Inspection Area | 450mm × 450mm |
| X-ray Leakage | <1μSv/h (Below safety standards) |
The system incorporates advanced numerical control (NC) programming capabilities to support automated inspection processes:
- Intuitive program creation through simple mouse operations
- Multi-axis positioning for precise alignment
- Software-based parameter adjustment for optimal imaging
- Comprehensive image optimization controls
- Customizable program timing settings
- Integrated anti-collision protection system
The Unicomp X-ray BGA inspection system has received positive reviews from global customers, with an average rating of 5.0 stars based on 50 recent evaluations.
"Excellent for detecting various contaminants in food products, capable of accurately identifying quartz and ceramic materials."
— M. Mony, Singapore (January 14, 2026)
"Reliable and efficient machine."
— M. M*k, Albania (December 3, 2025)
Unicomp offers a complete range of inspection systems, including:
- AX9100MAX X-ray machine optimized for IC package inspection
- LX2000 fully automated inline electronic X-ray machine
- UNX4015N X-ray system for food contamination detection
- UMC160 NDT X-ray machine with robotic handling for battery inspection
